STMicroelectronics TSV634IQ4T Automotive Operational Amplifier IC - 4 Circuits, 16-QFN Package
- Brand: STMicroelectronics
- Product Code: TSV634IQ4T
- Availability: In Stock
$0.70
- Ex Tax: $0.70
STMicroelectronics TSV634IQ4T: High-Performance Automotive Operational Amplifier for Precision Applications
The STMicroelectronics TSV634IQ4T is a cutting-edge operational amplifier designed specifically for automotive applications requiring exceptional precision, reliability, and performance. As part of STMicroelectronics' AEC-Q100 qualified series, this quad-channel amplifier delivers rail-to-rail output capabilities, ultra-low power consumption, and exceptional stability across extreme operating conditions. With its advanced design and automotive-grade certification, the TSV634IQ4T sets a new standard for general-purpose amplifiers in modern vehicle systems.
Key Features and Technical Specifications
Built with STMicroelectronics' proprietary semiconductor technology, the TSV634IQ4T combines multiple industry-leading specifications in a compact 16-QFN package. This four-channel operational amplifier operates efficiently from a wide 1.5V to 5.5V supply range while maintaining exceptional performance metrics:
Parameter | Value |
---|---|
Amplifier Type | General Purpose |
Output Type | Rail-to-Rail |
Slew Rate | 0.34V/µs |
Gain Bandwidth Product | 880 kHz |
Input Bias Current | 1 pA |
Input Offset Voltage | 3 mV |
Supply Current | 60µA (x4 Channels) |
Operating Temperature | -40°C to 125°C |
Automotive-Grade Reliability and Performance
As an AEC-Q100 qualified component, the TSV634IQ4T meets the stringent reliability requirements for automotive electronics. Its robust design ensures stable operation in harsh vehicle environments, from engine control units to advanced driver assistance systems (ADAS). The device's rail-to-rail output stage maximizes signal headroom while maintaining exceptional linearity across the entire operating range. The ultra-low input bias current (1 pA) and minimal offset voltage (3 mV) make it ideal for precision sensor interfacing and battery-powered applications.
Compact 16-QFN Packaging for Space-Saving Designs
Housed in a thermally efficient 3x3mm 16-VFQFN exposed pad package, the TSV634IQ4T offers significant board space savings while maintaining excellent thermal performance. This surface-mount package facilitates automated assembly processes and enables high-density PCB layouts in space-constrained automotive applications. The device's low power consumption (just 60µA per channel) further enhances its suitability for energy-sensitive systems, reducing overall power requirements without compromising performance.
Comprehensive Application Support
The TSV634IQ4T's versatility makes it suitable for a wide range of automotive applications including:
- Vehicle sensor signal conditioning
- Powertrain control modules
- Body electronics systems
- On-board diagnostics (OBD) interfaces
- Electric vehicle battery management
STMicroelectronics provides comprehensive design resources including application notes, reference schematics, and SPICE models to accelerate development cycles. The device's compatibility with industry-standard design tools simplifies simulation and verification processes.
Technical Advantages Over Competing Solutions
Compared to alternative solutions in its class, the TSV634IQ4T offers several distinct advantages:
- Wider operating temperature range (-40°C to 125°C) for enhanced reliability
- Lower supply current consumption for improved energy efficiency
- Exceptional input offset voltage stability across temperature variations
- Integrated ESD protection for enhanced robustness in automotive environments
- Superior thermal management through exposed pad package design
These technical advantages translate directly into real-world benefits for automotive designers, including reduced component count, simplified thermal management, and improved system accuracy across operating conditions.
Design and Manufacturing Excellence
STMicroelectronics' commitment to quality is evident in every aspect of the TSV634IQ4T's design and manufacturing. The device is produced in ST's state-of-the-art facilities using advanced CMOS processes that ensure consistent performance across production batches. Each unit undergoes rigorous testing to meet automotive industry quality standards, with traceability throughout the manufacturing chain. The device's tape and reel packaging format supports efficient automated handling and placement processes.
Future-Proof Automotive Solution
As automotive systems continue to evolve with increasing electrification and connectivity requirements, the TSV634IQ4T provides a future-proof foundation for next-generation designs. Its combination of low power operation, precision performance, and automotive qualification ensures compatibility with emerging vehicle architectures while maintaining backward compatibility with existing systems. Designers can confidently implement this component in current projects knowing it will support long-term product roadmaps.
Tags: General Purpose Amplifier, Automotive Electronics, Surface Mount IC, Precision Sensor Interface, Automotive Qualified Component