STMicroelectronics STPS30M100DJF-TR Schottky Diode

STMicroelectronics STPS30M100DJF-TR Schottky Diode

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High-Performance STPS30M100DJF-TR Schottky Diode for Power Electronics

Engineered for demanding power applications, the STMicroelectronics STPS30M100DJF-TR Schottky Diode combines cutting-edge technology with exceptional reliability. This advanced component delivers superior performance in rectification, voltage clamping, and freewheeling circuits, making it an essential element for modern power systems requiring efficiency and durability.

Technical Excellence in Power Management

With a maximum reverse voltage rating of 100V and 30A average rectified current capacity, this diode excels in high-power environments. Its ultra-low forward voltage drop of just 960mV at 30A significantly reduces conduction losses, translating to improved system efficiency and reduced thermal management requirements. The PowerFlat™ (5x6) package ensures optimal heat dissipation while maintaining a compact footprint for space-constrained designs.

The device's fast recovery characteristics (<=500ns) enable efficient operation in high-frequency switching applications, while its surface-mount design simplifies PCB assembly. The component maintains reliable performance up to 150°C junction temperature, demonstrating exceptional thermal stability in demanding operating conditions.

ParameterValue
Reverse Voltage100V
Forward Current30A
Forward Voltage960mV @ 30A
Leakage Current100µA @ 100V
Applications and Use Cases

This versatile diode finds applications across multiple industries, including:

  • Power supplies and DC-DC converters
  • Industrial motor drives
  • Renewable energy systems
  • Automotive electronics
  • High-efficiency lighting systems

Its robust design makes it particularly suitable for applications requiring high current density and minimal voltage drop, such as battery charging systems and power factor correction circuits.

Design Advantages

The STPS30M100DJF-TR offers several key advantages for circuit designers:

  • Space-saving PowerVDFN package
  • Reduced switching losses through fast recovery time
  • Enhanced thermal performance through advanced die attach technology
  • High reliability in harsh operating environments
  • Tape & Reel packaging for automated assembly processes

When compared to traditional diodes, this component demonstrates up to 30% lower conduction losses while maintaining comparable cost structures, making it an ideal choice for next-generation power electronics.

Technical Specifications

Key technical features include:

  • Surface-mount PowerFlat™ package (5x6mm)
  • Operating temperature range: -55°C to +150°C
  • RoHS compliant and halogen-free
  • Low profile (1.0mm max height)
  • High surge current capability

The device's compact form factor combined with its high current handling capability makes it particularly suitable for portable electronics and automotive applications where space and efficiency are critical design considerations.

Tags: Power Electronics, Voltage Regulation, Current Control, Industrial Components, Electronic Design

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